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Employment Type : Full-Time
Position Summary:Perform sustaining and process development activities for processes and tools in the GaAs wafer fabrication including dry etch, wet strip, wafer thinning, and backside processes.
Responsibilities:The candidate must be a highly motivated individual who will play a key role in the GaAs wafer fabrication facility. The potential candidate will have intimate knowledge of SPC and its role in wafer manufacturing, drive continuous improvement projects to minimize processing issues and improve productivity, and conceive and plan cost reduction projects, while ensuring quality products. Work in a fast-paced operation with the ability to multitask on multiple projects while determine priorities in addressing them.
Qualifications and Education Requirements
Preferred Skills
Job DescriptionPRIMARY RESPONSIBILITY: Develops new or modified process formulations, defines processing or handling equipment requirements and specifications, and reviews processing techniques and methods applied in the manufacture, fabrication, and evaluation of products. Involvement may begin at any step from pilot plant to full-scale manufacturing. Coordinates design requirement review with appropriate engineering/scientific personnel to ensure compatibility of processing methods. Compiles and evaluates test data to determine appropriate limits and variables for process or material specifications. May conceive and plan projects involving definition and selection of new concepts, equipment automation technology, and approaches in the processing or development of new or improved processes. NA
Nearest Major Market: Ventura
Nearest Secondary Market: Oxnard
Job Segment: Process Engineer, Manufacturing Engineer, Electronics Engineer, Engineer, Fabrication, Engineering, Manufacturing