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Employment Type : Full-Time
Please Note: 1. If you are a first time user, please create your candidate login account before you apply for a job. (Click Sign In > Create Account) 2. If you already have a Candidate Account, please Sign-In before you apply. Join this team focused on RF Front End Modules (FEM) for the LTE and 5G cellular markets. You will be part of the world-wide quality team to support development and qualification on new process and technology development towards final products. You will be also leading failure analysis from both internal and external customer requests utilizing in-house and external analytical services. Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, gender identity, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law. If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.
Requirements:
o Optical microscopes, Compound microscopes and metallography
o White light interferometry for surface/bump topography
o Sample preparation and Cross-sectioning / polishing, ion-milling.
o Ability to use X-ray, Ultrasound scan (C-SAM/T-scan) systems and interpret data
o Digital camera use and image processing
o Use of tester for die shear, wire pull, ball/bump shear, etc
o Experience with SEM/EDS and FIB tools
o Surface analysis tools: interferometry, IR imaging, PEM
o Mold compound decap tools, Module decap, backlap
o PCB and die metrology